Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST).           

During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as  Chief  Technology Officer of Nano & Advanced Materials Institute for two and a half years. Currently Dr Lee is Chair Professor of Smart Manufacturing Thrust and Acting Dean of Systems Hub at the HKUST Guangzhou Campus HKUST(GZ). He also has concurrent appointments as Executive Director of Shenzhen Platform Development Office, Director of Electronic Packaging Laboratory, and Director of Foshan Research Institute for Smart Manufacturing at HKUST.     

Dr Lee has been focusing his research on the technology development for electronics/optoelectronics packaging and additive manufacturing. The topics of his R&D interests include wafer level packaging and heterogeneous integration, 3D printing for microsystems packaging, LED packaging for solid-state lighting and applications beyond lighting, lead-free soldering and reliability analysis. The research outcomes of Dr Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 4 books and 10 book chapters.         

Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of 15 best/outstanding paper awards and 7 major professional society awards, Dr Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging.